{"id":4433,"date":"2024-09-03T13:34:48","date_gmt":"2024-09-03T12:34:48","guid":{"rendered":"https:\/\/cactux.cz\/?p=4433"},"modified":"2026-03-05T15:21:40","modified_gmt":"2026-03-05T14:21:40","slug":"cactux-introduces-in-situ-soldering-box-for-electronics","status":"publish","type":"post","link":"https:\/\/cactux.cz\/cs\/cactux-introduces-in-situ-soldering-box-for-electronics\/","title":{"rendered":"CactuX launches In-situ Soldering BOX for advanced electronic testing"},"content":{"rendered":"<p>[et_pb_section fb_built=&#8221;1&#8243; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; min_height=&#8221;2354px&#8221; custom_margin=&#8221;11px|||||&#8221; custom_padding=&#8221;10px||71px||false|false&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_row _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; min_height=&#8221;335px&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;-10px||25px||false|false&#8221; custom_padding=&#8221;0px||||false|false&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;]<\/p>\n<h6><span style=\"font-size: large;\">Have you ever wondered how the electronics in your smartphone, car, or even medical devices work?<\/span><span style=\"font-size: large;\"><b><\/b><\/span><\/h6>\n<p><span style=\"font-weight: 400;\"><\/span><span style=\"font-weight: 400;\">The answer lies in a small but crucial component: <strong>Printed Circuit Boards (PCBs)<\/strong>. These boards are the backbone of nearly every electronic device, ensuring everything runs smoothly, from your daily gadgets to cutting-edge space technology.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">In this article, we will closely examine how those components are <strong>manufactured and tested<\/strong> to perform flawlessly.<\/span><span style=\"font-weight: 400;\"><\/span><\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; custom_margin=&#8221;-10px||||false|false&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;]<\/p>\n<h2 style=\"text-align: left;\"><span style=\"color: #000000;\">Manufacturing and Testing of PCBs<\/span><\/h2>\n<p><span style=\"font-weight: 400;\">Manufacturing PCBs is a multi-step process that requires precision, consistency, and technological expertise. The predefined design is transferred to the conductive copper layer by printing the PCB layers. Then, tiny holes are drilled into the board, allowing components to be mounted. The holes are then plated with copper to create electrical connections. A protective layer called a solder mask is applied to get the board ready for <\/span><b>soldering.<\/b><\/p>\n<p><span style=\"font-weight: 400;\">Soldering is a critical process that connects all the components to the board, ensuring they communicate effectively. Depending on the complexity and type of PCB, the soldering can be done via different methods, including wave soldering, reflow soldering, or manual soldering. Any imperfections in the soldering process\u2014such as cold solder joints, bridging, or voids\u2014can lead to serious performance issues for the end device. This leads to the final step of manufacturing, <\/span><b>testing and inspection<\/b><span style=\"font-weight: 400;\">.<\/span><\/p>\n<p>[\/et_pb_text][et_pb_image src=&#8221;https:\/\/cactux.cz\/wp-content\/uploads\/2026\/01\/pcbs_soldering_scheme.png&#8221; alt=&#8221;A schematic image of a PCB soldering process.&#8221; title_text=&#8221;pcbs_soldering_scheme&#8221; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><span style=\"font-weight: 400;\">After the PCB is assembled, it undergoes rigorous testing to catch any potential defects. One standard method is using X-rays, which allow manufacturers to inspect the board without damaging it. Manufacturers can, this way, inspect and verify that solder joints are secure and there are no hidden issues that could cause problems later on.<\/span><\/p>\n<p>[\/et_pb_text][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;]<\/p>\n<h2 style=\"text-align: left;\"><span style=\"color: #000000;\">The Future of PCB Testing<\/span><\/h2>\n<p><span style=\"font-weight: 400;\">As the PCBs themselves are undergoing constant development for more and more advanced applications, the testing must keep up the pace. Although <strong>2D X-ray quality control<\/strong> has become a standard part of manufacturing processes, it cannot catch every issue. Some defects appear only after the device with PCB is in use when it&#8217;s exposed to heat or other stresses. These hidden defects can lead to device failures after they&#8217;ve already reached customers.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Therefore, manufacturing companies aim to find a solution for <strong>internal quality control<\/strong> that ensures the detection of all production defects, thereby preventing faulty products and reducing costs associated with product recalls and market withdrawals.\u00a0<\/span><\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;]<\/p>\n<h3><span style=\"font-size: x-large; color: #000000;\">CactuX introduced In-situ soldering BOX for 2D X-ray systems.<\/span><\/h3>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8221;3_5,2_5&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;3_5&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_image src=&#8221;https:\/\/cactux.cz\/wp-content\/uploads\/2026\/01\/in-situ-soldering-BOX.png&#8221; alt=&#8221;CactuX in-situ soldering BOX with inspected PCB.&#8221; title_text=&#8221;in-situ-soldering-BOX&#8221; _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; custom_padding=&#8221;|5px||||&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][et_pb_column type=&#8221;2_5&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; width=&#8221;100%&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;]<\/p>\n<p><span style=\"font-weight: 400;\">CactuX aims to expand the possibilities of<strong> 2D X-ray systems<\/strong> with its new <strong>In-situ BOX<\/strong> specifically designed to <strong>test solder joints<\/strong>. A tool that enhances traditional 2D X-ray systems by allowing <strong>real-time monitoring of the soldering process<\/strong>. This add-on simulates the exact conditions under which soldering happens, such as temperature changes, so manufacturers can watch for defects as they form.<\/span><\/p>\n<p><span style=\"font-weight: 400;\"><\/span><\/p>\n<p><span style=\"font-weight: 400;\">This technology helps manufacturers pinpoint issues like <strong>void formation<\/strong> and understand how materials behave during soldering. As a result, companies can improve their <strong>soldering techniques<\/strong>, making electronic components more <strong>reliable and durable<\/strong>.<\/span><\/p>\n<p><span style=\"font-weight: 400;\"><\/span><\/p>\n<p><span style=\"font-size: large;\"><b>CactuX In-situ soldering BOX reveals new and deeper information about PCB functionality for the manufacturers.<\/b><\/span><\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; text_font=&#8221;||||||||&#8221; header_line_height=&#8221;1.8em&#8221; hover_enabled=&#8221;0&#8243; global_colors_info=&#8221;{}&#8221; sticky_enabled=&#8221;0&#8243;]<\/p>\n<p><em>Interested in exploring how <strong data-start=\"189\" data-end=\"221\">CactuX In-Situ Soldering BOX<\/strong> can improve your soldering process and PCB quality? Our team is ready to discuss your specific needs, provide technical advice, or schedule a demo measurement. <a href=\"https:\/\/cactux.cz\/cs\/contact\/\"><strong data-start=\"482\" data-end=\"502\">Contact us today <\/strong><\/a>to discover how our solutions can help you.<\/em><\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][et_pb_row column_structure=&#8221;3_5,2_5&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;3_5&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_image src=&#8221;https:\/\/cactux.cz\/wp-content\/uploads\/2024\/09\/EU-SPOLUFINANCOVANO-Barevne.png&#8221; title_text=&#8221;EU-SPOLUFINANCOV\u00c1NO Barevn\u00e9&#8221; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][et_pb_column type=&#8221;2_5&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_image src=&#8221;https:\/\/cactux.cz\/wp-content\/uploads\/2024\/09\/mpo.jpg&#8221; title_text=&#8221;mpo&#8221; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][\/et_pb_image][\/et_pb_column][\/et_pb_row][et_pb_row _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_column type=&#8221;4_4&#8243; _builder_version=&#8221;4.16&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;][et_pb_text _builder_version=&#8221;4.27.4&#8243; _module_preset=&#8221;default&#8221; global_colors_info=&#8221;{}&#8221;]<\/p>\n<p><b>This project is co-funded by the European Union.<\/b><\/p>\n<p><span style=\"font-weight: 400;\">Project name:<\/span><b> Development of a heating element in thick film technology on AlN substrate (V\u00fdvoj topn\u00e9ho t\u011blesa v tlustovrstv\u00e9 technologii na AlN substr\u00e1tu)<\/b><\/p>\n<p><span style=\"font-weight: 400;\">Project goal:<\/span><b> <span>The main objective is to complete the development of a special product that enables high-precision quality control of solder joints using X-ray imaging<\/span><\/b><\/p>\n<p><span style=\"font-weight: 400;\">Registration number:<\/span><b> CZ.01.01.01\/05\/23_009\/0003367<\/b><\/p>\n<p><span style=\"font-weight: 400;\">Place of implementation:<\/span><b> Hlavn\u00ed 683\/104, Lelekovice, 664 31 Brno-venkov<\/b><\/p>\n<p><b>Operational Programme Technology and Applications for Competitiveness (Opera\u010dn\u00ed program technologie a aplikace pro konkurenceschopnost)<\/b><\/p>\n<p>Provider:<b><a href=\"\/cs\/ministerstvo%20pr\u016fmyslu a obchodu zm\u011bnov\u00fd list\/\"> Ministry of Industry and Trade CZ<\/a> (Ministerstvo pr\u016fmyslu a obchodu)<\/b><\/p>\n<p><br style=\"font-weight: 400;\" \/><br style=\"font-weight: 400;\" \/><\/p>\n<p><br style=\"font-weight: 400;\" \/><br style=\"font-weight: 400;\" \/><\/p>\n<p>[\/et_pb_text][\/et_pb_column][\/et_pb_row][\/et_pb_section]<\/p>","protected":false},"excerpt":{"rendered":"<p>Have you ever wondered how the electronics in your smartphone, car, or even medical devices work? The answer lies in a small but crucial component: Printed Circuit Boards (PCBs). These boards are the backbone of nearly every electronic device, ensuring everything runs smoothly, from your daily gadgets to cutting-edge space technology. In this article, we [&hellip;]<\/p>","protected":false},"author":9,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_et_pb_use_builder":"on","_et_pb_old_content":"","_et_gb_content_width":"","om_disable_all_campaigns":false,"inline_featured_image":false,"_monsterinsights_skip_tracking":false,"_monsterinsights_sitenote_active":false,"_monsterinsights_sitenote_note":"","_monsterinsights_sitenote_category":0,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-4433","post","type-post","status-publish","format-standard","hentry","category-all"],"_links":{"self":[{"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/posts\/4433","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/users\/9"}],"replies":[{"embeddable":true,"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/comments?post=4433"}],"version-history":[{"count":16,"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/posts\/4433\/revisions"}],"predecessor-version":[{"id":5659,"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/posts\/4433\/revisions\/5659"}],"wp:attachment":[{"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/media?parent=4433"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/categories?post=4433"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/cactux.cz\/cs\/wp-json\/wp\/v2\/tags?post=4433"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}